JPH0462459B2 - - Google Patents

Info

Publication number
JPH0462459B2
JPH0462459B2 JP59060996A JP6099684A JPH0462459B2 JP H0462459 B2 JPH0462459 B2 JP H0462459B2 JP 59060996 A JP59060996 A JP 59060996A JP 6099684 A JP6099684 A JP 6099684A JP H0462459 B2 JPH0462459 B2 JP H0462459B2
Authority
JP
Japan
Prior art keywords
protruding electrodes
protruding
width
lead
film carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59060996A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60206158A (ja
Inventor
Hiroshi Takahashi
Isamu Kitahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59060996A priority Critical patent/JPS60206158A/ja
Publication of JPS60206158A publication Critical patent/JPS60206158A/ja
Publication of JPH0462459B2 publication Critical patent/JPH0462459B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/1401—Structure
    • H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59060996A 1984-03-30 1984-03-30 突起電極付フイルムキヤリア Granted JPS60206158A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59060996A JPS60206158A (ja) 1984-03-30 1984-03-30 突起電極付フイルムキヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59060996A JPS60206158A (ja) 1984-03-30 1984-03-30 突起電極付フイルムキヤリア

Publications (2)

Publication Number Publication Date
JPS60206158A JPS60206158A (ja) 1985-10-17
JPH0462459B2 true JPH0462459B2 (en]) 1992-10-06

Family

ID=13158548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59060996A Granted JPS60206158A (ja) 1984-03-30 1984-03-30 突起電極付フイルムキヤリア

Country Status (1)

Country Link
JP (1) JPS60206158A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100798896B1 (ko) * 2007-06-07 2008-01-29 주식회사 실리콘웍스 반도체 칩의 패드 배치 구조

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead

Also Published As

Publication number Publication date
JPS60206158A (ja) 1985-10-17

Similar Documents

Publication Publication Date Title
EP1020903B1 (en) A semiconductor device using a lead frame and its manufacturing method
KR100989007B1 (ko) 반도체 디바이스
JPH02272737A (ja) 半導体の突起電極構造及び突起電極形成方法
JPH08321671A (ja) バンプ電極の構造およびその製造方法
JPH079953B2 (ja) 半導体装置の製造方法
EP1003209A1 (en) Process for manufacturing semiconductor device
JP3632024B2 (ja) チップパッケージ及びその製造方法
JP3279470B2 (ja) 半導体装置およびその製造方法
US3763550A (en) Geometry for a pnp silicon transistor with overlay contacts
JPH0462459B2 (en])
EP0526147B1 (en) Film-carrier type semiconductor device and process for fabricating the same
JPH0719797B2 (ja) 半導体装置の実装具
JP3702480B2 (ja) 電極パッドの形成方法
JP2555878B2 (ja) フィルムキャリヤーテープの製造方法
JPH05166812A (ja) 半導体素子
JPH03268385A (ja) はんだバンプとその製造方法
JPH09199631A (ja) 半導体装置の構造と製造方法
JPH07221101A (ja) 半導体ウエハ上への突起電極形成方法
JPS60214548A (ja) 突起電極付リ−ド端子
JP3057194B2 (ja) 半導体パッケージの製造方法
JPH01286430A (ja) 半導体チップの実装方法
JPS60140737A (ja) 半導体装置の製造方法
JPH01215033A (ja) 半導体チップ用ボンディングパッド
JP3934011B2 (ja) 半導体装置及びその製造方法
JP2941533B2 (ja) 半導体チップのワイヤレスボンディング方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term